发明名称 Electrically insulating resin composition and method for forming thin film therefrom
摘要 An electrically insulating thin-film-forming resin composition comprising (A) an inorganic or organic electrically insulating resin having silicon atom-bonded hydrogen atoms, (B) a compound having groups able to react with the silicon atom-bonded hydrogen atoms in component (A) and having a boiling point under atmospheric pressure of at least 250° C., and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.
申请公布号 US2001010840(A1) 申请公布日期 2001.08.02
申请号 US20010765199 申请日期 2001.01.18
申请人 KOBAYASHI AKIHIKO;MINE KATSUTOSHI;NAKAMURA TAKASHI;SAWA KIYOTAKA 发明人 KOBAYASHI AKIHIKO;MINE KATSUTOSHI;NAKAMURA TAKASHI;SAWA KIYOTAKA
分类号 C08K5/00;C08L83/05;C09D4/00;C09D5/25;C09D183/05;H01B3/00;H01B3/46;H01L21/31;H01L21/312;(IPC1-7):C08J7/04;C08K5/24 主分类号 C08K5/00
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