发明名称 |
Electrically insulating resin composition and method for forming thin film therefrom |
摘要 |
An electrically insulating thin-film-forming resin composition comprising (A) an inorganic or organic electrically insulating resin having silicon atom-bonded hydrogen atoms, (B) a compound having groups able to react with the silicon atom-bonded hydrogen atoms in component (A) and having a boiling point under atmospheric pressure of at least 250° C., and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.
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申请公布号 |
US2001010840(A1) |
申请公布日期 |
2001.08.02 |
申请号 |
US20010765199 |
申请日期 |
2001.01.18 |
申请人 |
KOBAYASHI AKIHIKO;MINE KATSUTOSHI;NAKAMURA TAKASHI;SAWA KIYOTAKA |
发明人 |
KOBAYASHI AKIHIKO;MINE KATSUTOSHI;NAKAMURA TAKASHI;SAWA KIYOTAKA |
分类号 |
C08K5/00;C08L83/05;C09D4/00;C09D5/25;C09D183/05;H01B3/00;H01B3/46;H01L21/31;H01L21/312;(IPC1-7):C08J7/04;C08K5/24 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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