Passive alignment using slanted wall pedestal

摘要

An apparatus is provided including a first chip having a plurality of solder bumps and recesses formed therein at preselected locations. A second chip is provided with a plurality of solder pads and projections. A plurality of solder bonds are coupled between the first and second chips. At least one of the recesses and projections includes angled walls for capturing and directing the other during reflow of the solder bonds such that the first chip aligns relative to the second chip under the surface tension of the solder bonds. If desired, vibrating waves may be applied to the first and second chips during reflow to assist movement of the projections relative to the recesses.