发明名称 Optical module using wiring lead integrated resin substrate
摘要 An optical module capable of connecting signal lines to an external substrate easily without causing any degradation of the transmission characteristic is disclosed. The optical module comprises an optical element mounting block having an optical element mounting section and an optical fiber guide, and a wiring lead integrated resin substrate having a ferrule holding section, an optical element mounting block housing section, and wiring leads, where at least a part of the wiring leads are provided by signal lines in a coplanar guide structure entirely formed on the wiring lead integrated resin substrate such that a characteristic impedance does not change when the wiring leads are electrically connected to external wirings.
申请公布号 US2001010744(A1) 申请公布日期 2001.08.02
申请号 US20010764785 申请日期 2001.01.17
申请人 SHUTO YOSHITO;AMANO MICHIYUKI;YOKOYAMA KENJI;KUROSAKI TAKESHI;TADOKORO TAKASHI;NAKAMURA MAKOTO;OKAYASU MASANOBU;ISHIHARA NOBORU;SUMIDA SHIN;TOHNO SHUNICHI 发明人 SHUTO YOSHITO;AMANO MICHIYUKI;YOKOYAMA KENJI;KUROSAKI TAKESHI;TADOKORO TAKASHI;NAKAMURA MAKOTO;OKAYASU MASANOBU;ISHIHARA NOBORU;SUMIDA SHIN;TOHNO SHUNICHI
分类号 G02B6/42;(IPC1-7):G02B6/42 主分类号 G02B6/42
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