发明名称 Thermoplastic resin composition
摘要 There is disclosed a thermoplastic resin composition comprising; (i) 30 to 94% by weight of a polypropylene (A), (ii) 5 to 69% by weight nf a polyphenylene ether (B), and (iii) 1 to 50% by weight of a copolymer (C), provided that a total weight of the components (A), (B) and (C) is 100% by weight, wherein the copolymer (C) has a molar ratio of a structural unit derived from the alpha-olefin represented by the following formula (I) to a structural unit derived from ethylene of not less than (0.8/(3n+2)/1, <paragraph lvl="0"><in-line-formula>CH2=CH-(CH2)nCH2CH3 (I) </in-line-formula>wherein n is an integer of 0 to 10.
申请公布号 US2001011118(A1) 申请公布日期 2001.08.02
申请号 US20010759256 申请日期 2001.01.16
申请人 SANADA TAKASHI 发明人 SANADA TAKASHI
分类号 C08L71/12;(IPC1-7):C08L71/12 主分类号 C08L71/12
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