| 摘要 |
An object is to make possible, in a semiconductor device, a compact configuration when mounting semiconductor elements in a package, with which, as necessary, a configuration wherein the semiconductor elements are arranged three-dimensionally and interconnected can be easily effected, thus permitting higher functionality to be achieved. The configuration is effected such that thin semiconductor chips having a thickness of 50 mum or so are imbedded and mounted inside the package, and such that multi-level stacking is facilitated by providing external connection terminals on both surfaces of the package, or, alternatively, exposing the terminal formation portions of the wiring pattern, to which the external connection terminals are to be connected, out of a solder resist layer.
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