发明名称 |
METHOD FOR FABRICATING TFT |
摘要 |
PURPOSE: A method for fabricating a TFT(Thin Film Transistor) is provided to improve a step coverage by forming a trench bottom gate TFT. CONSTITUTION: An oxide layer(22) is deposited on a silicon substrate(21). A trench is formed by performing an etch process. A polysilicon layer is formed by depositing a polysilicon on the oxide layer(22) and the trench. A trench gate line(23) is formed by etching back the polysilicon layer. A gate insulating layer(24) is deposited on the oxide layer(22) and the gate line(23). A body polysilicon is deposited thereon. A polysilicon layer is formed by performing an annealing process the body polysilicon. An ion implant process is performed to implant ions into the polysilicon layer. A photoresist pattern is formed by performing a photo mask process. A drain junction is formed by performing an ion implant process. A source/drain junction(211) is formed by implanting ions.
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申请公布号 |
KR100305877(B1) |
申请公布日期 |
2001.08.02 |
申请号 |
KR19930016093 |
申请日期 |
1993.08.19 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
NOH, JAE SEONG;RA, SA GYUN |
分类号 |
H01L21/3205;H01L21/336;H01L27/12;H01L29/78;H01L29/786;(IPC1-7):H01L27/12 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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