| 摘要 |
<p>A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method comprising forming a brass (zinc-copper) plating layer on the surface of a copper foil, forming an electrolytic chromate layer on the surface of said brass plating layer, forming a layer of a silane coupling agent adsorbed on said electrolytic chromate layer, and drying the copper foil for 2 to 6 seconds under a condition wherein the temperature thereof is in the range of 105°C to 200°C. The surface treated copper foil takes full advantage of the effect of a silane coupling agent which is generally used in a copper foil having a brass plating rust-inhibiting layer, and thereby exhibits a deterioration percentage for the resistance to hydrochloric acid of 10 % or less even with respect to a copper foil circuit being 0.2 mm wide and further is excellent in moisture resistance.</p> |
