SURFACE TREATED COPPER FOIL AND METHOD FOR PREPARING THE SAME AND COPPER-CLAD LAMINATE USING THE SAME

摘要

A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method comprising forming a zinc or zinc alloy plating rust-inhibiting layer on the surface of a copper foil, forming an electrolytic chromate layer on the surface of said rust-inhibiting layer, forming a layer of a silane coupling agent adsorbed on said electrolytic chromate layer, and drying the copper foil for 2 to 6 seconds under a condition wherein the temperature thereof is in the range of 105 DEG C to 200 DEG C. The surface treated copper foil takes full advantage of the effect of a silane coupling agent which is generally used in a copper foil having a zinc or zinc alloy plating rust-inhibiting layer, and thereby exhibits a deterioration percentage for the resistance to hydrochloric acid of 10 % or less even with respect to a copper foil circuit being 0.2 mm wide and further is excellent in moisture resistance characteristics, heat resistance characteristics and long term storage stability .