发明名称 |
Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device |
摘要 |
An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
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申请公布号 |
US2001010409(A1) |
申请公布日期 |
2001.08.02 |
申请号 |
US20010810293 |
申请日期 |
2001.03.16 |
申请人 |
WENSEL RICHARD W. |
发明人 |
WENSEL RICHARD W. |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L21/322;H01L23/28;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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