| 摘要 |
<p>A method and apparatus for cleaning a wafer (100) in a dual brush cleaning system is disclosed. Two brushes (101, 103), preferably made of PVA and wetted by cleaning fluids, are positioned opposite one another and spaced apart enough to allow a portion of a wafer (100) to be inserted between their working surfaces and make frictional engagement with them. The top brush (101) is rotated at a first speed and the bottom brush (103) is rotated at a second faster speed sufficient for the freely rotating wafer (100) to rotate at the same speed and in the same direction as the top brush (101). The bottom brush (103) may have raised areas (108) on its surface to assist in efficiently gripping and rotating the wafer (100). A common rotation speed and direction causes a uniform relative velocity between the top brush (101) and the wafer (100) that results in an improved cleaning operation.</p> |
