| 摘要 |
<p>A system and method for polishing semiconductor wafers includes a rotatable polishing pad (36) movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer (w). A pad dressing assembly (16) positioned coplanar, and adjacent, to the wafer provides in-situ pad conditioning to a portion of the polishing pad (36) not in contact with the wafer. The method includes the step of radially moving the polishing pad (36) with respect to the wafer.</p> |
