| 摘要 |
<p>An LDMOS power package includes a mounting substrate having a surface comprising one or more alignment elements, e.g., an etched marker line, raised abutment, or a trough, to provide for uniform positioning of semiconductor elements, e.g., the transistor die and matching input and output capacitors, in a large scale production. In one embodiment, the power package includes a conductive mounting flange having a surface, the flange surface comprising a plurality of alignment elements. An input matching capacitor is attached to the flange surface proximate a first alignment element. A semiconductor die having a plurality of transistor elements is attached to the flange surface proximate a second alignment element. An output matching capacitor is attached to the flange surface proximate a third alignment element.</p> |
