CONDUCTOR PATTERN BUILT IN MULTILAYER BOARD, MULTILAYER BOARD HAVING BUILT-IN CONDUCTOR PATTERN, AND METHOD OF MANUFACTURING MULTILAYER BOARD

摘要

A conductor pattern having a low electrical resistance and an excellent adhesion to a board and not causing the board to crack during plating, a multilayer board in which such a conductor patterns is built, and a method of manufacturing a multilayer board are disclosed. A conductor composite containing a metal powder containing 95 mass % or more of silver, a sintering suppressor containing chromium and/or a chromium compound, a dielectric-loss improver containing manganese and/or a manganese compound, and a vehicle is produced. Next, electrodes are formed on a plurality of green sheets with the conductor composite. Then, the green sheets on which electrodes are formed are stacked to form a stack, which is then fired.