RADIOCOMMUNICATION MODULE IN THE FORM OF AN ELECTRONIC MACRO-COMPONENT, CORRESPONDING INTERFACE STRUCTURE AND TRANSFER METHOD ONTO A MOTHERBOARD

摘要

The invention concerns a radiocommunication equipment module (32), designed to be transferred onto a motherboard (31) comprising components mounted on a printed circuit and providing at least one of the following functions: RF processing, digital processing and analog processing. The invention is characterised in that the module comprises a set of conductive elements (35), distributed over said printed circuit lower surface, and arranged in such a manner that said set of conductive elements constitute simultaneously: electromagnetic shielding means for said printed circuit lower surface; electrical interconnecting means, enabling electric signals to pass through to and/or from said motherboard; and means for transferring said radiocommunication module onto said motherboard. Thus the radiocommunication module constitutes an electronic macro-component.