发明名称 |
Power semiconductor module for use in power conversion units with downsizing requirements |
摘要 |
<p>A power semiconductor module comprises a circuit board made of an insulating substrate of good thermal conductivity formed with interconnect patterns, a plurality of power semiconductor chips mounted on the circuit board, bonding wires for electrically connecting the semiconductor chips and the interconnect patterns, outer lead terminals fixed to the interconnect patterns, and a resin layer for covering at least the chip mounted surface of the circuit board in its entirety so that the tip of each of the outer lead terminals is exposed. <IMAGE> <IMAGE> <IMAGE></p> |
申请公布号 |
EP1121009(A2) |
申请公布日期 |
2001.08.01 |
申请号 |
EP20010101642 |
申请日期 |
2001.01.26 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TSUNODA, TETSUJIRO;NAKAO, SATOSHI;IMAMURA, KAORU;UMEKAWA, SHINICHI |
分类号 |
H02M7/00;(IPC1-7):H02M7/00;H05K7/14;H01R13/24 |
主分类号 |
H02M7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|