| 摘要 |
PURPOSE: A conductive polymer composite, and a forming and plating method using it are provided to plate a nonconductor such as ceramic and plastic with a metal coating, and to eliminate an etching process among pre-treatment processes causing the contamination of environment. CONSTITUTION: The conductive polymer composite consists of polythiophene of 50 to 60 wt percent, solvent of 20 to 25 wt percent, a first binder including polyurethane of 10 to 15 wt percent, a second binder including polyacryl of 1 to 5 wt percent, and other additives including an antifoaming agent. Primer is applied on coating area of a plastic or ceramic molding to form adhesive layer. The conductive polymer composite is coated on the top of the primer adhesive layer, thereby a conductive coating required to an electroplating method is created. Also, at least one plating film is manufactured by using the conductive coating.
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