发明名称 ENCAPSULATION OF A DEVICE
摘要 An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.
申请公布号 EP1119878(A1) 申请公布日期 2001.08.01
申请号 EP19990933462 申请日期 1999.07.09
申请人 OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG 发明人 GUENTHER, EWALD KARL MICHAEL
分类号 G09F9/30;H01L21/44;H01L27/32;H01L33/00;H01L51/52 主分类号 G09F9/30
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