发明名称 |
ENCAPSULATION OF A DEVICE |
摘要 |
An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package. |
申请公布号 |
EP1119878(A1) |
申请公布日期 |
2001.08.01 |
申请号 |
EP19990933462 |
申请日期 |
1999.07.09 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG |
发明人 |
GUENTHER, EWALD KARL MICHAEL |
分类号 |
G09F9/30;H01L21/44;H01L27/32;H01L33/00;H01L51/52 |
主分类号 |
G09F9/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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