EQUIPMENT FOR DEPOSITING THIN FILM OF SEMICONDUCTOR WAFER

摘要

PURPOSE: An equipment for depositing a thin film of a semiconductor wafer is provided to minimize generation of particles due to variation of internal temperature when a semiconductor wafer of room temperature is introduced to a chamber of high temperature. CONSTITUTION: A wafer cassette(20) is put on a station part(110). A transporting unit is installed on a load-lock chamber to load and unload a semiconductor wafer(10) from chambers(130,150). The semiconductor wafer(10) contained in the wafer cassette(20) is transported to the first sub chamber(130) by the transporting unit(160). A planar zone of the semiconductor wafer(10) is aligned on the first sub chamber(130) and a process of preheating the semiconductor wafer is proceeded. The semiconductor wafer aligned and preheated in the first sub chamber(130) is transported to a processing chamber(140) by the transporting unit(160). The semiconductor wafer is heated to a predetermined temperature in the processing chamber(140) and a thin film deposition is proceeded with. The semiconductor wafer is then transported to the second sub chamber(150) by the transporting unit(160). The semiconductor wafer is cooled down in the second sub chamber(150). The cooled semiconductor wafer is contained in the wafer cassette(20) of the station part(110).