| 摘要 |
A pallet for mounting components on a double sided PCB including a fab (panel) having a frame area surrounding a depression. A shoulder around the depression is dimensioned to support the fab. The fab is laid on the shoulder with the a group of components mounted in a previous reflow operation in the space between the depression and a first area of the fab. The print, pick and place and reflow operations are performed to mount a second group of components on the opposite side of the fab. The first area of the fab is shielded from the heat of the oven so that the first components do not separate from the fab during the second reflow step. Standoffs in the depression prevent sagging of the board. Another area of the pallet has a recessed area with cutouts for wave soldering components located on the third area of the fab.
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