发明名称 METHOD FOR THERMALLY MOLDING THERMOPLASTIC RESIN SHEET
摘要 PROBLEM TO BE SOLVED: To provide a method for thermally molding a thermoplastic resin sheet into a food tray, an electronic part packaging tray or various kinds of packaging materials or the like with the help of an infrared heater. SOLUTION: When the thermoplastic resin sheet is thermally molded, it is possible to cut short a molding cycle, i.e., heating time by using infrared rays with a maximum energy wavelength of 3μm or less. Further, it is possible to reduce the number of rejects and thereby upgrade the productivity by restricting the drawdown of the thermoplastic resin sheet and consequently minimizing the variability of moldings. The method for thermally molding the thermoplastic resin sheet operated as described achieves a multi-cavity molding process through restricting the drawdown of the sheet in a moldable region and the keeping of a presentable surface appearance. In addition, this method is easily applicable to the existing installation merely by changing a heating source.
申请公布号 JP2001205696(A) 申请公布日期 2001.07.31
申请号 JP20000019617 申请日期 2000.01.28
申请人 DENKI KAGAKU KOGYO KK 发明人 KAWACHI KOICHI;KADOYA YUICHI;TOKUNAGA HISAJI
分类号 B65D65/40;B29C35/08;B29C51/42;(IPC1-7):B29C51/42 主分类号 B65D65/40
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