| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device with which increase in the volume of a plating liquid replenished to a plating tank is prevented and the cost of treating the waste plating liquid is reduced. SOLUTION: This plating device is provided with a plating tank 10 storing a plating liquid 1 and wherein an article to be plated is dipped and electroplated by an anode and a cathode, a control means 16 for controlling the plating of the article, a concentration detecting means 14 driven by the control means 16 and detecting the concentration of a plating component in the plating liquid 1 consumed by the plating in the tank 10, a replenishing means 18 for dissolving and adding a plating material 2 as the plating component directly to the plating liquid 1 in the tank 10 in accordance with the detection result of the means 14 under the control of the means 16 and a circulating means 12 driven by the control means 16, circulating the plating liquid 1 in the tank 10 and mixing the plating material 2 added by the replenishing means 18 and the plating liquid 1.
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