| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive having sufficient flexibility, high electrical insulation, high heat resistance, good wire-bonding tendency and high electrical reliability under high-temperature and high-humidity conditions, in particular suitable for applying to planar mount-type semiconductor devices and interposers, and to provide the subject adhesive tape using the above adhesive. SOLUTION: This adhesive for semiconductor devices comprises (a) a polyfunctional epoxy resin of the formula (2-1), (b) a polyamide resin and (c) a phenolic resin. The other objective adhesive tape for semiconductor devices is obtained by laminating an adhesive layer made of the above adhesive on a polyimide film.
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