发明名称 TAPED PACKAGE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a taped package of an electronic component wherein static electricity occurring on the component is allowed to escape outside, comprising a plurality of electronic components with a lead extending from the component wherein the components are held by the leads by sticking a tape mount to an adhesive tape. SOLUTION: The taped package of the electronic component holds, by a lead 1b, the electronic component 1 with the lead 1b extending from a body 1a by sticking the tape mount 2 to the adhesive tape 3. The adhesive tape 3 comprises a conductive adhesive agent 3b applied on one of surfaces of a tape base 3a.
申请公布号 JP2001206439(A) 申请公布日期 2001.07.31
申请号 JP20000023258 申请日期 2000.01.27
申请人 ROHM CO LTD 发明人 OKAZAKI TADAHIRO
分类号 B65D73/02;B65B15/04;(IPC1-7):B65D73/02 主分类号 B65D73/02
代理机构 代理人
主权项
地址