发明名称 ELECTROFORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electroforming device by which an electroformed film is almost uniformly formed on the surface of a work such as a glass substrate. SOLUTION: In this electroforming device 100, a plating tank 120 for storing plating solution, a cathode 150 and an anode 130 opposed in the plating tank at a specified interpolar distance, a work to be electroformed arranged on the cathode and a shielding part on the work are provided. In this case, a gap for preventing the retention of plating solution is formed between the work 140 and shielding part 200 in this electroforming device 100.
申请公布号 JP2001207284(A) 申请公布日期 2001.07.31
申请号 JP20000023354 申请日期 2000.01.27
申请人 SONY CORP 发明人 SEGAWA YUJI;SUZUKI MASATOSHI;ITO MAKOTO;TAZOE MINORU
分类号 C25D1/00;(IPC1-7):C25D1/00 主分类号 C25D1/00
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