| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject epoxy resin composition having a short gelling time and reduced dielectric constant responding to the tendency of higher frequency in view of the current situation that the semiconductor device technology is in progress in terms of design compatible with the tendency of higher frequency. SOLUTION: This epoxy resin composition essentially comprises the components (A) to (E) mentioned below; wherein the proportion for the components (A) and (C) is such that the equivalent ratio of the cyanate ester groups including the reacted groups in the component (C) to the epoxy groups in the component (A) is 0.10-2.00: (A) epoxy resin, (B) phenolic resin, (C) triazine resin, (D) curing promoter, and (E) inorganic filler.
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