发明名称 Method and apparatus for mounting electronic components
摘要 Method and apparatus for mounting electronic components in which components are efficiently fed and transferred for enhancing productivity is provided. Tray draw-out device (6) is disposed at a component feeding unit (4) for pulling out a tray (3) accommodating electronic components (2) from the component feeding unit (4) to a given pick-up position, where the electronic components (2) are transferred by the transfer mechanism (11) on to a temporary holder (8) disposed on a draw-out arm (7) of the tray draw-out device (6). Mounting head (5) has a plurality of mounting nozzles (5a), with which the mounting head (5) picks up several electronic components (2) aligned on the temporary holder (8) at a time and mount them on to a circuit board (1) which has been loaded and located at a prescribed position.
申请公布号 US6266873(B1) 申请公布日期 2001.07.31
申请号 US19990367514 申请日期 1999.11.18
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KITAMURA NAOYUKI;OKUDA OSAMU;KABESHITA AKIRA;TAKEDA TAKESHI
分类号 H05K13/04;(IPC1-7):H05K3/30 主分类号 H05K13/04
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