发明名称 Reliability testing method of dielectric thin film
摘要 A method for testing the reliability of a dielectric thin film. An exponential current ramp test is performed with a delay time to test the dielectric thin film. An exponential current ramp charge-to-breakdown distribution, which is represented by cumulative distribution failure percentage, is obtained. An exponential current ramp charge-to-breakdown at a cumulative distribution failure percentage is calculated. An exponential current ramp constant and a constant current stress constant at the cumulative distribution failure percentage are calculated. A constant current stress charge-to-breakdown at the cumulative distribution failure percentage is calculated by using a specified current density and the constant current stress constant at the cumulative distribution failure percentage. The constant current stress charge-to-breakdown at the cumulative distribution failure percentage is compared to a specified constant current stress charge-to-breakdown to determine the reliability of the dielectric thin film.
申请公布号 US6269315(B1) 申请公布日期 2001.07.31
申请号 US19990232202 申请日期 1999.01.14
申请人 UNITED MICROELECTRONICS CORP. 发明人 FU KUAN-YU;LIU CHUAN H.;CHENG DONALD;YANG SHENG-HSING;WANG MU-CHUN
分类号 G01R31/12;(IPC1-7):G01R27/02 主分类号 G01R31/12
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