发明名称 |
Reliability testing method of dielectric thin film |
摘要 |
A method for testing the reliability of a dielectric thin film. An exponential current ramp test is performed with a delay time to test the dielectric thin film. An exponential current ramp charge-to-breakdown distribution, which is represented by cumulative distribution failure percentage, is obtained. An exponential current ramp charge-to-breakdown at a cumulative distribution failure percentage is calculated. An exponential current ramp constant and a constant current stress constant at the cumulative distribution failure percentage are calculated. A constant current stress charge-to-breakdown at the cumulative distribution failure percentage is calculated by using a specified current density and the constant current stress constant at the cumulative distribution failure percentage. The constant current stress charge-to-breakdown at the cumulative distribution failure percentage is compared to a specified constant current stress charge-to-breakdown to determine the reliability of the dielectric thin film.
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申请公布号 |
US6269315(B1) |
申请公布日期 |
2001.07.31 |
申请号 |
US19990232202 |
申请日期 |
1999.01.14 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
FU KUAN-YU;LIU CHUAN H.;CHENG DONALD;YANG SHENG-HSING;WANG MU-CHUN |
分类号 |
G01R31/12;(IPC1-7):G01R27/02 |
主分类号 |
G01R31/12 |
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