Lead frame device for delivering electrical power to a semiconductor die

摘要

A method and apparatus for delivering electrical power to a semiconductor die is provided in which a metal frame (104) is applied to the top surface of a semiconductor die. The metal frame include two voltages leads (106, 108), each adjacent to each series of bond pads (116) formed on the top surface of the semiconductor die. Each voltage lead includes a longitudinal portion (122) adjacent bond pads (116) in the center of the semiconductor die and corner portions (124) or arm portions (125) adjacent bond pads (116) located in the quadrants (114) of the semiconductor die.