发明名称 ONE-COMPONENT LIQUID EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a one-component liquid epoxy resin composition which is excellent in airtightness, especially in adhesion to a liquid crystal polymer and to a metal terminal even at high temperatures in a reflow treatment, in a small-sized relay using a liquid crystal polymer as one of constituting materials. SOLUTION: This resin composition, used for the airtight sealing or insulation sealing of a small-sized electronic or electric part, is a one-component liquid epoxy resin composition which does not contain dicyandiamide. More specifically, the composition preferably contains an imidazole compound (excepting dicyandiamide) as a curing agent and calcium carbonate as a filler.
申请公布号 JP2001207029(A) 申请公布日期 2001.07.31
申请号 JP20000018555 申请日期 2000.01.27
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJIMOTO TAKAZO
分类号 C08L63/00;C08G59/40;C08K3/26;(IPC1-7):C08L63/00 主分类号 C08L63/00
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