| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject resin composition having a good flowability/ formability and soldering heat resistance in its mounting, causing no resin cracking, high in adhesivity, excellent in moisture resistance after mounted, and securing its long-term reliability, and to provide semiconductor-sealed devices using the above resin composition. SOLUTION: This resin composition for sealing use essentially comprises (A) a phenolic resin curing agent modified with a condensed polycyclic aromatic hydrocarbon such as naphthalene or anthracene, (B) an epoxy resin, (C) 25-95 wt.% of an inorganic filler and (D) a curing promoter. The other objective semiconductor-sealed devices are such that the semiconductor chips are sealed with the cured product of the above resin composition.
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