| 摘要 |
PROBLEM TO BE SOLVED: To reduce the damage applied to a wafer caused by the contact of a cup-shaped grinding wheel with the wafer as much as possible, when grinding a work by the cup-shaped grinding wheel. SOLUTION: The cup-shaped grinding wheel 3 and the wafer S are so arranged that the width center of the grinding part 3A of the cup-shaped grinding wheel 3 is positioned in the rotation center of the wafer S. The cup-shaped grinding wheel 3 and the wafer S are rotated to grind one side of the wafer. Then, the cup-shaped grinding wheel 3 and the wafer S are so arranged that an angle formed by the circumferential edge of the grinding part 3A in the cup-shaped grinding wheel and the circumferential edge of the wafer S in their contact point becomes shallow.
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