发明名称 SOLDERING FLUX
摘要 PROBLEM TO BE SOLVED: To provide flux and solder paste high in preservative stability, furthermore to provide a soldering method corresponding to fine-pitching and the diversification of parts and high in reliability and to provide a joined article. SOLUTION: A glycoside having a phenolic hydroxyl group is added to the flux as a reducing agent. The ratio of the particles of 20μm or less in the solder powder is controlled to 30% or less by a number distribution, the content oxygen is controlled to 500 ppm or less, and the content of moisture in the solder paste is controlled to 0.5 wt.% or less.
申请公布号 JP2001205480(A) 申请公布日期 2001.07.31
申请号 JP20000013872 申请日期 2000.01.18
申请人 SHOWA DENKO KK 发明人 MURASE NORIKO;AMITA HITOSHI;SHOJI TAKASHI
分类号 B23K1/00;B23K35/363;(IPC1-7):B23K35/363 主分类号 B23K1/00
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