| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing semiconductor wafers expressing excellent expandability and excellent in chipping resistance in processing the semiconductor wafers. SOLUTION: In an adhesive sheet for processing semiconductor wafers obtained by coating an adhesive layer comprising a base polymer, a radiation- polymerizable compound and an initiator for radiation polymerization on a film base material having permeability to ultraviolet rays and/or electron beams, the base film material comprises a mixture of 20-80 wt.% of a polypropylene with 80-20 wt.% of a block copolymer obtained by hydrogenating a block copolymer consisting of blocks A comprising at least two terminal polymers mainly comprising a vinyl aromatic compound and an intermediate polymer block B mainly comprising at least one conjugated diene compound.
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