发明名称 |
Method and apparatus for reclaiming a metal from a cmp process for use in an electroplating process |
摘要 |
A method and apparatus is disclosed for reclaiming a metal from the effluent of a chemical mechanical planarization (CMP) process and using the reclaimed metal in an electroplating process. The steps of the method include using a chemical solution in a CMP process to remove material from a semiconductor device. An effluent is produced by this step that contains a dissolved first species removed from the semiconductor device. Then a second step of treating the effluent is performed to remove the dissolved first species and to produce a reclaimed metal. Then a third step of using the metal in an electroplating process is performed. |
申请公布号 |
AU3447101(A) |
申请公布日期 |
2001.07.31 |
申请号 |
AU20010034471 |
申请日期 |
2001.01.17 |
申请人 |
DAVID K. WATTS |
发明人 |
DAVID K. WATTS |
分类号 |
B24B37/04;C02F1/42;C02F1/467;C25D21/16;C25D21/18;C25D21/22 |
主分类号 |
B24B37/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|