| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro-guide structure requiring a shorter plating time and less aftertreatment by reducing a difference in electric plating speed and keeping the height of the finally completed structure in order. SOLUTION: A micro-guide mechanism comprises a substrate, a fixed member fixed to the substrate, and a micro-spring member having a rectangular flat member with a portion swollen in the cross direction to form a columnar portion, the micro-spring member having a micro-cantilever fixed at one end to the fixed member and a mover, the mover being connected to the free end of the micro-cantilever and adapted to be movable relative to the substrate with the deflection of the micro-cantilever, and the mover and the micro- cantilever being formed of the same material. |
