| 摘要 |
An electric module which includes a printed circuit board and at least one electrical subassembly arranged thereon is disposed within a metallic housing and is grounded to the metallic housing by way of a wire bridge which extends transversely across a cutout disposed in the printed circuit board. The metallic housing is integrally connected to a contact tongue which extends through the cutout and the printed circuit board before engaging the wire bridge. The wire bridge connects one side of the printed circuit board to a ground conductor track disposed on the opposing side of the printed circuit board. Preferably, the contact tongue includes two closely spaced contact elements that are spaced apart for frictionally receiving the wire bridge therebetween. Further, the cutout extends transversely across the contact bridge at an angle so the flat plug-like contact element also extends across the wire bridge transversely at an angle for improved frictional engagement between the wire bridge and the two contact elements. Preferably, the contact elements cut into or mar the wire bridge upon insertion.
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