| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a resin composition for semiconductor sealing which is used for forming a sealing resin layer of a semiconductor device and exhibits suitable characteristics after thermal curing and to provide a semiconductor device which has a sealing resin layer formed by curing the resin composition, hardly causes the rupture of a connecting electrode, and has a high reliability. SOLUTION: The resin composition is used for sealing a gap between a circuit board substrate and a semiconductor device and exhibits, after thermally cured, a modulus at 25 deg.C higher than 9.8 GN/m2 and a linear thermal expansion coefficient lower than 18×10-6/ deg.C. The semiconductor device has a sealing resin layer formed by curing the resin composition.</p> |
