发明名称 |
Method for forming fine-pitched solder bumps |
摘要 |
A method for forming solder balls that have larger spacings between them and electronic devices containing such solder balls are disclosed. In the method, an additional layer of a leachable metal such as gold or silver is used between an under bump metallurgy layer and a solder bump subsequently formed. This allows the formation of the under bump metallurgy layer prior to the deposition of the solder material into a window formed in a photoresist layer. The present invention allows the underfill of a solder window, instead of an overfill which is normally required in a conventional method.
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申请公布号 |
US6268114(B1) |
申请公布日期 |
2001.07.31 |
申请号 |
US19980156353 |
申请日期 |
1998.09.18 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
WEN YING-NAN;KUNG LING-CHEN;LU SZU-WEI;UANG RUOH-HUEY |
分类号 |
H01L21/60;(IPC1-7):G03C5/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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