| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treating system by which dust hardly adheres to a substrate, and also uniformity of plasma treatment to a large substrate is improved. SOLUTION: In this plasma treating system, plasma generated by a linelike plasma generating part (1) is used, and a substrate (12) carried in a direction crossed with the above line direction in plan view is subjected to plasma treatment. The system is also provided with an exhaust port (9) disposed adjacently to the outlet of the plasma generating part and a plate (11) disposed to the space between the exhaust port and a substrate carrying face. |
