发明名称 COPPER ALLOY FOR ELECTRONIC MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a copper alloy having good bendability as well as high strength and electric conductivity. SOLUTION: This alloy has a composition containing, by mass, 1.5 to 3.5% Ni and 0.35 to 1.0% Si, furthermore containing 0.005 to 0.1% Fe and/or one or more kinds of Zr, Cr, Ti and Mo of 0.005 to 0.2% in total, in which, by a weight ratio, Ni/Si is also controlled to 3 to 7, and the balance Cu with inevitable impurities.
申请公布号 JP2001207229(A) 申请公布日期 2001.07.31
申请号 JP20000018319 申请日期 2000.01.27
申请人 NIPPON MINING & METALS CO LTD 发明人 MAKI TETSUO
分类号 C22C9/06;C22C9/00;H01B1/02;(IPC1-7):C22C9/06 主分类号 C22C9/06
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