发明名称
摘要 <p>PROBLEM TO BE SOLVED: To adjust the thickness of a sealing film, between columnar electrodes of a semiconductor device, in its early stages. SOLUTION: The sealing film 16 is formed with a print mask and a squeegee 15. In this case, the tip of the squeegee 15 has a flank almost in a V-shape and is pressed in between columnar electrodes 12 for printing. Then the sealing film 16 is recessed between the columnar electrodes 12. In this case, the thickness of the sealing film 16 is directly proportional to the weight of liquid sealing resin printed on a silicon substrate 11. The print quantity (weight) of the liquid sealing resin printed on the silicon substrate 11, is in inversely proportional to the intrusion quantity of the squeegee 15 (how much the tip part of the squeegee 15 is pressed inbetwen the columnar electrodes 12 from the top surface of the columnar electrodes 12). For the purpose, the press-in quantity of the squeegee 15 is adjusted to suppress the weight of the liquid sealing resin printed on the silicon substrate 11, and consequently the thickness of the sealing film 16 can be controlled.</p>
申请公布号 JP3194045(B2) 申请公布日期 2001.07.30
申请号 JP19990260925 申请日期 1999.09.14
申请人 发明人
分类号 H01L23/12;H01L21/60;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
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