发明名称 SUBSTRATE TREATING DEVICE
摘要 PURPOSE: To provide a substrate treating device capable of uniformly supplying a treating liquid on the surface of a substrate without affecting the physical properties of a treating liquid and damaging the substrate in the substrate treatment such as development processing. CONSTITUTION: In the substrate treating device for treating the surface of the substrate with the treating liquid, the substrate 1 is horizontally arranged, a rotary blade 2 is oppositely arranged above the substrate 1, the treating liquid is supplied to the surface of the substrate 1, the rotary blade 2 is rotated in non-contact state with the treating liquid to generate air flow 6 and a treating liquid group 5 having circulating flow inside is formed below the rotary blade 2 and on the surface of the substrate by the air flow 6.
申请公布号 KR20010071142(A) 申请公布日期 2001.07.28
申请号 KR20000059984 申请日期 2000.10.12
申请人 EBARA CORP. 发明人 SHINOZAKI HIROYUKI
分类号 H01L21/302;B05C11/06;B05D1/00;H01L21/00;H01L21/027;H01L21/311;H01L21/312;(IPC1-7):H01L21/302 主分类号 H01L21/302
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