METHOD FOR FORMING LEAD OF SEMICONDUCTOR PACKAGE AND LEAD FRAME SLITTING APPARATUS FOR THE SAME

摘要

PURPOSE: A method for forming a lead of a semiconductor package and a lead frame slitting apparatus for the same are provided to improve the productivity by shaping easily a lead line. CONSTITUTION: An opening portion is formed at a center portion of a lead frame(2) formed with a long band shape. A semiconductor package(4) connected with a lead line(6) is arranged on the opening portion. An L-shaped connection bar(40) is formed by performing a cutting process along a surrounding portion of the opening portion. The lead line(6) is connected with one end of the L-shaped connection bar(40). The lead frame(2) is connected with the other end of the L-shaped connection bar(40). The L-shaped connection bar(40) and the lead line(6) are bent and shaped by performing a forming process.