| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method which enables dicing, without damaging a chip to be separated and reduces the number of defective chips. SOLUTION: A scribe line 11 is formed on the surface 10a of a silicon wafer, and first dicing is performed from the back 10b side of a silicon wafer W along the scribe line 11. Thereby a dicing trace 12 is formed from the back 10b of the silicon wafer W. Second dicing is performed from the back along the dicing trace 12. Thereby silicon wafer W is separated into chips 13. |
