CONDUCTIVE PASTE FOR INTERLAYER CONNECTION AND AS MULTILAYER PRINTED WIRING BOARD USING THE SAME, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a technique where a through-hole or a via hole which is used to electrically connect layers, whose diameter is small and whose aspect ratio is high can be filled with a conductive paste so as to be of high in electrical reliability. SOLUTION: The conductive paste for interlayer connection is a conductive paste which is filled into the through-hole or the via hole used to electrically connect the layers in a multilayer printed wiring board. At least, a part of conductive fillers in the paste is composed of a magnetic material. When the layers are connected in the multilayer printed wiring board, the magnetic conductive fillers are connected in a chain shape in such a way that they are oriented by a magnetic field, and conductors in upper layers and lower layers are connected electrically.