| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure for a semiconductor module in which an allowable current of a semiconductor becomes large. SOLUTION: In order to cool the semiconductor (not shown) mounted on a base 13, a cooler 21 is mounted on the base 13 to be cooled. Since the cooler 21 has a recess opened toward the base 13, a heat generated from the semiconductor is directly transferred to cooling water flowing therein. Therefore, a temperature difference corresponding to a thermal resistance of a heat sink is eliminated different from flowing of water into the heat sink. A heating amount to be removed in the water is increased by an amount corresponding to the thermal resistance of the heat sink. Even when so much heat is generated, the semiconductor is not thermally destroyed, but an allowable current of the semiconductor is increased in response to the amount corresponding to an increase in the heating amount.
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