发明名称 HOT PLATE UNIT
摘要 PROBLEM TO BE SOLVED: To provide a hot plate unit which can be cooled in a shot time, without complicating or enlarging the structure. SOLUTION: In a hot plate unit 1, a holt plate 3 having a resistor 10 is placed at the opening 4 of a casing 2. The casing 2 and hot plate 3 constitute a space S1 through which liquid can flow. A sealing structure 14 is disposed between the upper edge of the opening 4 of the casing 2 and the peripheral portion of the bottom of the hot plate 3.
申请公布号 JP2001203156(A) 申请公布日期 2001.07.27
申请号 JP20000356424 申请日期 2000.11.22
申请人 IBIDEN CO LTD 发明人 FURUKAWA MASAKAZU;ITO YASUTAKA;SAITO YUZURU
分类号 H05B3/68;H01L21/027;(IPC1-7):H01L21/027 主分类号 H05B3/68
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