| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device to be handled as one substrate at a low cost without having effect of a noise and a heat from a power part loading a power element to a controller loading a control element for controlling the power element. SOLUTION: The power element 4 is loaded on a metal substrate 1, and the control element 5 is loaded on a resin insulating substrate 2. The substrate 1, 2 respectively have one or more metal thin films 1e, 2c for connecting the boards. The substrate 1 is disposed adjacent to the substrate 2, and the film 1e is connected to the film 2c via a metal plate 6. |
