| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus of substrate planarization to manufacture a substrate surface of superior quality with high throughput. SOLUTION: In this advanced electrolytic polishing(AEP) method, a metal wafer (10) acts as an anodic electrode and another metal plate (65) is used as a cathodic electrode. A voltage difference is applied to the anode and cathode, under a predetermined anodic dissolution current density. This causes a reaction that provides a planarized surface on the metal wafer. Additives are included in an electrolytic solution (55), which adsorb onto the wafer surface urging a higher removal rate at higher spots of a substrate surface and a lower removal rate at lower spots of the substrate surface.
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