| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction structure in IC chips for eliminating the need for covering the entire IC chips with an adhesion resin for protection and for allowing one portion of the laminated IC chips to float in the air. SOLUTION: The junction structure of IC chips comprises a substrate, an adhesion resin for gluing the IC chips to the substrate, and a bonding tool that is formed larger than the IC chips and compression-bonds the IC chips, and the upper surface of the adhesion resin is expanded to an outer-periphery part on a plane that is flush with the IC chips for formation, a plurality of IC chips that are glued onto the substrate by the adhesion resin are placed side by side for compression-bonding, and another IC chip is laminated and placed onto the plurality of IC chips that are placed and glued on the substrate side by side for compression-bonding.
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